All Resource Articles
Samsung to begin fabricating products with 3nm GAA node in 2022
Samsung recently revealed it had taped out chips utilizing its 3nm gate-all-around (GAA) process. It intends to use its new node to fabricate next-generation microelectronics in 2022.
Intel reportedly in talks to purchase GlobalFoundries for $30 billion
According to the Wall Street Journal, Intel has entered negotiations to buy GlobalFoundries from its parent company for $30 billion. The surprising potential acquisition has received a mixed reception from industry watchers.
Erocore offers passive components the latest consumer electronics require
Erocore becoming an innovative player in the passive components sector. As a result, manufacturers can utilize its parts to meet robust demand for consumer electronics this holiday season.
Intel wants to build a $100 billion semiconductor manufacturing ecosystem in Europe
Intel has big plans to establish a $100 billion semiconductor manufacturing ecosystem within Europe. However, it wants the trade bloc’s support in realizing its ambitious development roadmap.
Nvidia’s Jetson Nano unlocks the potential of the connected robotics & embedded analytics markets
Analysts believe the IoT-connected robotic and AI-enabled embedded analytics markets have explosive growth potential. Nvidia’s Jetson Nano is key to unlocking hugely lucrative opportunities across multiple industries.
Sourcengine now hosting world-class connectors from Amphenol, Molex, and TE Connectivity
Sourcengine has an extensive selection of fully traceable Amphenol Corporation, Molex, and TE Connectivity connectors in stock thanks to our partnership with a franchised distributor. Even better, the components are available for delivery worldwide
Huawei establishing first chip manufacturing facility in China, production to start in 2022
Huawei is reportedly working to establish its first chip factory in Wuhan, China. The fab is on schedule to begin producing optical communications components and modules in 2022.
Apple and Intel to release new products with TSMC’s 3nm manufacturing process
Apple and Intel are reportedly working with TSMC with an eye toward using its 3nm node to make their forthcoming products. The foundry's next-generation manufacturing process offers double-digit upgrades on its current 5nm node.
NXP Semiconductors and Jio Platforms teaming up to expand 5G coverage in India
NXP Semiconductors revealed it is collaborating with Jio Platforms to expand the functionality of India’s 5G infrastructure. It also reportedly partnered with a leading foundry to reinforce its supply chain.
GlobalFoundries begins construction on $4B 300mm wafer fab in Singapore
GlobalFoundries, the world’s fourth-biggest contract chipmaker, announced it broke ground on a $4 billion fab. The Singaporean facility will make 450,000 silicon wafers (300mm) per month by 2023