Sockets and Chip Carriers

CONN SOCKET SIP 8POS TIN

CONN SOCKET SIP 5POS TIN

IC Socket, DIP32, 32 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder

IC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder

IC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder

IC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder

IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder

IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder

IC sockets with capacitor, type MPE-GARRY MPQ. With multilayer ceramic capacitor (0.1 µF); Rated voltage: 100 VRMS/150 VDC. Rated current: 1.0 A. Insulating body: thermoplastic to UL 94 V-0. Contacts: brass/beryllium copper gold-plated. Operating temperatures: –55 to +125 °C. Technical attributes (number of poles, dimensions): 001-4-028-6-B1STH-XT0, 28-pole, A 35.48, B 17.70, C 15.24 mm

IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder

IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder

IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder

IC Socket, DIP32, 32 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder

IC Socket, DIP32, 32 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder

IC Socket, DIP40, 40 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder

IC Socket, DIP40, 40 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder

IC Socket, DIP40, 40 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder

IC Socket, DIP40, 40 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder

IC Socket, SIP4, 4 Contact(s), 2.54mm Term Pitch, Wire Wrap

IC Socket, SIP32, 32 Contact(s), 2.54mm Term Pitch, Wire Wrap

IC Socket

IC Socket, SIP60, 60 Contact(s), 2.54mm Term Pitch, Solder

IC Socket, SIP13, 1 Contact(s), 2.54mm Term Pitch, Solder

IC Socket, PGA208, 208 Contact(s)

IC Socket, DIP16, 16 Contact(s)