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TMPR3912XB-75

Toshiba Corporation

Toshiba Corporation TMPR3912XB-75
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.25
  • Format
    FIXED POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    13
  • Length (mm)
    13
  • Speed (MHz)
    75
  • JESD-30 Code
    S-PBGA-B217
  • Package Code
    LFBGA
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Low Power Mode
    YES
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Integrated Cache
    YES
  • Address Bus Width
    13
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    217
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.4
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    32
  • Supply Current-Max (mA)
    130
  • Package Equivalence Code
    BGA217,15X15,32
  • Clock Frequency-Max (MHz)
    9.216
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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TMPR3912XB-75
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TMPR3912XB-75