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TMP82C55AP-2

Toshiba Corporation

TMP82C55AP-2 Datasheet
Toshiba Corporation TMP82C55AP-2
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • Width (mm)
    15.24
  • Length (mm)
    50.7
  • JESD-30 Code
    R-PDIP-T40
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Number of Ports
    3
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of I/O Lines
    24
  • Number of Terminals
    40
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    4.8
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    8
  • Supply Current-Max (mA)
    5
  • uPs/uCs/Peripheral ICs Type
    PARALLEL IO PORT, GENERAL PURPOSE
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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TMP82C55AP-2
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TMP82C55AP-2