ProductsManufacturers
Events
Send an RFQBOM Tool

TMP82C55AM-2

Toshiba Corporation

Toshiba Corporation TMP82C55AM-2
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • Width (mm)
    8.8
  • Length (mm)
    17.5
  • JESD-30 Code
    R-PDSO-G40
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Number of Ports
    3
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of I/O Lines
    24
  • Number of Terminals
    40
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.8
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    8
  • Supply Current-Max (mA)
    5
  • uPs/uCs/Peripheral ICs Type
    PARALLEL IO PORT, GENERAL PURPOSE
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for TMP82C55AM-2

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
TMP82C55AM-2
Send an RFQ
TMP82C55AM-2