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TMP47P430VN

Toshiba Corporation

Toshiba Corporation TMP47P430VN
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Bit Size
    4
  • Technology
    CMOS
  • Width (mm)
    10.16
  • Length (mm)
    25.6
  • JESD-30 Code
    R-PDIP-T28
  • Package Code
    SDIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE, SHRINK PITCH Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Address Bus Width
    0
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Number of I/O Lines
    19
  • Number of Terminals
    28
  • Program Memory Type
    OTPROM
  • Terminal Pitch (mm)
    1.778
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    4.1
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3
  • External Data Bus Width
    0
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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TMP47P430VN