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TMP47C820F

Toshiba Corporation

Toshiba Corporation TMP47C820F
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    14
  • JESD-30 Code
    S-PQFP-G80
  • Package Code
    QFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    QUAD
  • Number of Terminals
    80
  • Program Memory Type
    MROM
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.15
  • Supply Voltage-Max (V)
    6
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -40

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TMP47C820F
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TMP47C820F