ProductsManufacturers
Events
Send an RFQBOM Tool

THGBM7G9T8JBAIG

Toshiba Corporation

THGBM7G9T8JBAIG Datasheet
Toshiba Corporation THGBM7G9T8JBAIG
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NAND TYPE
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B153
  • Memory Width
    8
  • Package Shape
    RECTANGULAR
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH CARD
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Memory Organization
    64GX8
  • Number of Functions
    1
  • Number of Terminals
    153
  • Number of Words Code
    64G
  • Memory Density (bits)
    549755813888
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Number of Words (words)
    68719476736
  • Programming Voltage (V)
    2.7
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -25

0 suppliers available to buy or to bid for THGBM7G9T8JBAIG

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
THGBM7G9T8JBAIG
Send an RFQ
THGBM7G9T8JBAIG