ProductsManufacturers
Events
Send an RFQBOM Tool

TC94B15WBG

Toshiba Corporation

Toshiba Corporation TC94B15WBG
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B20
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Consumer IC Type
    VOLUME CONTROL CIRCUIT
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    20
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA20,4X5,20
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -30

0 suppliers available to buy or to bid for TC94B15WBG

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
TC94B15WBG
Send an RFQ
TC94B15WBG