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TC9350BFN-T01

Toshiba Corporation

TC9350BFN-T01 Datasheet
Toshiba Corporation TC9350BFN-T01
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    4.4
  • Length (mm)
    5
  • JESD-30 Code
    R-PDSO-G16
  • Package Code
    LSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.6
  • Supply Voltage-Max (V)
    5.25
  • Supply Voltage-Min (V)
    4.35
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    5
  • Package Equivalence Code
    SSOP16,.25
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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TC9350BFN-T01