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TC7LX1104WBG(EL)

Toshiba Corporation

Toshiba Corporation TC7LX1104WBG(EL)
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B12
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Pitch
    0.4 mm
  • Interface IC Type
    INTERFACE CIRCUIT
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    12
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA12,3X4,16
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel

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TC7LX1104WBG(EL)
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TC7LX1104WBG(EL)