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TC59LM813AMG-50

Toshiba Corporation

Toshiba Corporation TC59LM813AMG-50
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.28
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B60
  • Memory Width
    16
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    DDR1 DRAM
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    32MX16
  • Number of Terminals
    60
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    0.65
  • Number of Words Code
    32M
  • Memory Density (bits)
    536870912
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    33554432
  • Sequential Burst Length
    2,4
  • Interleaved Burst Length
    2,4
  • Package Equivalence Code
    BGA60,6X15,40
  • Clock Frequency-Max (MHz)
    200
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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TC59LM813AMG-50
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TC59LM813AMG-50