ProductsManufacturers
Events
Send an RFQBOM Tool

TC58DVM92A3BAJW

Toshiba Corporation

Toshiba Corporation TC58DVM92A3BAJW
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    SLC NAND TYPE
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B63
  • Memory Width
    8
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    64MX8
  • Number of Functions
    1
  • Number of Terminals
    63
  • Number of Words Code
    64M
  • Memory Density (bits)
    536870912
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Number of Words (words)
    67108864
  • Package Equivalence Code
    BGA64,8X8,32
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for TC58DVM92A3BAJW

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
TC58DVM92A3BAJW
Send an RFQ
TC58DVM92A3BAJW