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TC358768AXBG(EL)

Toshiba Corporation

Toshiba Corporation TC358768AXBG(EL)
  • Technology
    CMOS
  • Width (mm)
    4.5
  • Length (mm)
    4.5
  • JESD-30 Code
    S-XBGA-B72
  • Package Code
    VFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Interface IC Type
    INTERFACE CIRCUIT
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    72
  • Terminal Pitch (mm)
    0.4
  • Package Body Material
    UNSPECIFIED
  • Seated Height-Max (mm)
    1
  • Supply Voltage-Max (V)
    1.3
  • Supply Voltage-Min (V)
    1.1
  • Supply Voltage-Nom (V)
    1.2
  • Package Equivalence Code
    BGA72,9x9,16
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -30

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TC358768AXBG(EL)
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TC358768AXBG(EL)