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TC358767AXBG

Toshiba Corporation

Toshiba Corporation TC358767AXBG
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    5
  • Length (mm)
    5
  • JESD-30 Code
    S-PBGA-B81
  • Package Code
    VFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Interface IC Type
    INTERFACE CIRCUIT
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    81
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1
  • Supply Voltage-Max (V)
    1.26
  • Supply Voltage-Min (V)
    1.14
  • Supply Voltage-Nom (V)
    1.2
  • Package Equivalence Code
    BGA81,9X9,20
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -20

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TC358767AXBG
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TC358767AXBG