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TC358764XBG

Toshiba Corporation

Toshiba Corporation TC358764XBG
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    5
  • Length (mm)
    5
  • JESD-30 Code
    S-PBGA-B49
  • Package Code
    TFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    49
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    1.3
  • Supply Voltage-Min (V)
    1.1
  • Supply Voltage-Nom (V)
    1.2
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -30

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TC358764XBG
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TC358764XBG