ProductsManufacturers
Events
Send an RFQBOM Tool

S29WS01GSAAWHW300

INFINEON TECHNOLOGIES AG

INFINEON TECHNOLOGIES AG S29WS01GSAAWHW300
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Width
    11 mm
  • Length
    13 mm
  • Boot Block
    TOP
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B186
  • Memory Width
    16
  • Organization
    64MX16
  • Package Code
    TFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    1073741824 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.65 mm
  • Access Time-Max
    115 ns
  • Number of Words
    67108864 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    SYNCHRONOUS BURST ACCESS ALSO POSSIBLE
  • Number of Functions
    1
  • Number of Terminals
    186
  • Programming Voltage
    1.8 V
  • Number of Words Code
    64M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -25 Cel
  • Supply Voltage-Max (Vsup)
    1.95 V
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Supply Voltage-Nom (Vsup)
    1.8 V

0 suppliers available to buy or to bid for S29WS01GSAAWHW300

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
S29WS01GSAAWHW300
Send an RFQ
S29WS01GSAAWHW300