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PEX8624-BB50BIF

Broadcom Inc.

Broadcom Inc. PEX8624-BB50BIF
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    19
  • Length (mm)
    19
  • JESD-30 Code
    S-PBGA-B324
  • Package Code
    HBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Address Bus Width
    0
  • Bus Compatibility
    I2C; ISA; SMBUS; SPI; VGA
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    324
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.48
  • Supply Voltage-Max (V)
    1.05
  • Supply Voltage-Min (V)
    0.95
  • Supply Voltage-Nom (V)
    1
  • External Data Bus Width
    0
  • Clock Frequency-Max (MHz)
    100
  • uPs/uCs/Peripheral ICs Type
    BUS CONTROLLER, PCI
  • Data Transfer Rate-Max (MBps)
    0.0125
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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PEX8624-BB50BIF