INFINEON TECHNOLOGIES AG PEF22827ELV1.1
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    S-PBGA-B225
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Pitch
    0.8 mm
  • Telecom IC Type
    MODEM
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    225
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA225,15X15,32
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    235

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PEF22827ELV1.1
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PEF22827ELV1.1