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LSI53C875GV

Broadcom Inc.

Broadcom Inc. LSI53C875GV
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    23
  • Length (mm)
    23
  • JESD-30 Code
    S-PBGA-B169
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • Address Bus Width
    32
  • Bus Compatibility
    PCI
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    169
  • Terminal Pitch (mm)
    1.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.4
  • Supply Voltage-Max (V)
    5.25
  • Supply Voltage-Min (V)
    4.75
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    32
  • Drive Interface Standard
    X3.131
  • Clock Frequency-Max (MHz)
    33.33
  • uPs/uCs/Peripheral ICs Type
    BUS CONTROLLER, SCSI
  • Data Transfer Rate-Max (MBps)
    40
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

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LSI53C875GV
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LSI53C875GV