ProductsManufacturers
Events
Send an RFQBOM Tool

K3UH6H60BM-AGCL0

SAMSUNG ELECTRO-MECHANICS

SAMSUNG ELECTRO-MECHANICS K3UH6H60BM-AGCL0
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B556
  • Memory Width
    64
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    LPDDR4X DRAM
  • Operating Mode
    ASYNCHRONOUS
  • Number of Ports
    1
  • Terminal Position
    BOTTOM
  • Memory Organization
    768MX64
  • Number of Functions
    1
  • Number of Terminals
    556
  • Number of Words Code
    768M
  • Memory Density (bits)
    51539607552
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    1.8
  • Number of Words (words)
    805306368
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -25

0 suppliers available to buy or to bid for K3UH6H60BM-AGCL0

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
K3UH6H60BM-AGCL0
Send an RFQ
K3UH6H60BM-AGCL0