Integrated Silicon Solution Inc. IS66WVE1M16TBLL-55BLI
  • ECCN
    3A991.B.2.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    6 mm
  • Length
    8 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B48
  • Memory Width
    16
  • Organization
    1MX16
  • Package Code
    TFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    16777216 bit
  • Memory IC Type
    PSEUDO STATIC RAM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.75 mm
  • Access Time-Max
    55 ns
  • Number of Words
    1048576 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    48
  • Number of Words Code
    1M
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V

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