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IS66WV25632BLL-55BLI

Integrated Silicon Solution Inc.

Integrated Silicon Solution Inc. IS66WV25632BLL-55BLI
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • Width (mm)
    8
  • Length (mm)
    13
  • JESD-30 Code
    R-PBGA-B90
  • Memory Width
    32
  • Package Code
    LFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    PSEUDO STATIC RAM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    256KX32
  • Number of Functions
    1
  • Number of Terminals
    90
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    55
  • Number of Words Code
    256K
  • Memory Density (bits)
    8388608
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.45
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.5
  • Supply Voltage-Nom (V)
    3
  • Number of Words (words)
    262144
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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IS66WV25632BLL-55BLI