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IS64NVP12836EC-200B3LA3

Integrated Silicon Solution Inc.

Integrated Silicon Solution Inc. IS64NVP12836EC-200B3LA3
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Width (mm)
    13
  • Length (mm)
    15
  • JESD-30 Code
    R-PBGA-B165
  • Memory Width
    36
  • Package Code
    TBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    ZBT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    BOTTOM
  • Memory Organization
    128KX36
  • Number of Functions
    1
  • Number of Terminals
    165
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    3.1
  • Number of Words Code
    128K
  • Memory Density (bits)
    4718592
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    2.625
  • Supply Voltage-Min (V)
    2.375
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    131072
  • Standby Current-Max (A)
    0.1
  • Standby Voltage-Min (V)
    2.37
  • Supply Current-Max (mA)
    235
  • Package Equivalence Code
    BGA165,11X15,40
  • Clock Frequency-Max (MHz)
    200
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    AEC-Q100

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IS64NVP12836EC-200B3LA3