IS61DDP2B21M18A2-300M3LI

Integrated Silicon Solution Inc.

Integrated Silicon Solution Inc. IS61DDP2B21M18A2-300M3LI
  • ECCN
    3A991.B.2.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    15 mm
  • Length
    17 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B165
  • Memory Width
    18
  • Organization
    1MX18
  • Package Code
    LBGA
  • Output Enable
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    18874368 bit
  • Memory IC Type
    DDR II PLUS SRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Access Time-Max
    0.45 ns
  • Number of Ports
    1
  • Number of Words
    1048576 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    1.4 mm
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    750 mA
  • Number of Functions
    1
  • Number of Terminals
    165
  • Standby Current-Max
    0.32 Amp
  • Standby Voltage-Min
    1.71 V
  • Number of Words Code
    1M
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    BGA165,11X15,40
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    1.89 V
  • Supply Voltage-Min (Vsup)
    1.71 V
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Clock Frequency-Max (fCLK)
    300 MHz
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30

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IS61DDP2B21M18A2-300M3LI