IS43TR16512BL-15HBLI
Integrated Silicon Solution Inc.
- Lifecycle statusActive-Unconfirmed
- RoHSRoHS compliant
- REACHREACH compliant
- DescriptionDDR3L DRAM, 512MX16, CMOS, PBGA96
- Category
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8542.32.00.36
- SB Code8542.32.00.23
- I/O TypeCOMMON
- TechnologyCMOS
- Width (mm)10
- Access ModeMULTI BANK PAGE BURST
- Length (mm)14
- JESD-30 CodeR-PBGA-B96
- Memory Width16
- Package CodeTFBGA
- Self RefreshYES
- Package ShapeRECTANGULAR
- Package StyleGRID ARRAY, THIN PROFILE, FINE PITCH Meter
- Surface MountYES
- Terminal FormBALL
- J-STD-609 Codee1
- Memory IC TypeDDR3L DRAM
- Operating ModeSYNCHRONOUS
- Refresh Cycles8192
- Number of Ports1
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- Temperature GradeINDUSTRIAL
- Terminal PositionBOTTOM
- Additional FeatureAUTO/SELF REFRESH
- Memory Organization512MX16
- Number of Functions1
- Number of Terminals96
- Terminal Pitch (mm)0.8
- Number of Words Code512M
- Memory Density (bits)8589934592
- Package Body MaterialPLASTIC/EPOXY
- Output Characteristics3-STATE
- Seated Height-Max (mm)1.2
- Supply Voltage-Max (V)1.45
- Supply Voltage-Min (V)1.283
- Supply Voltage-Nom (V)1.35
- Number of Words (words)536870912
- Sequential Burst Length4,8
- Standby Current-Max (A)0.034
- Supply Current-Max (mA)177
- Interleaved Burst Length4,8
- Package Equivalence CodeBGA96,9X16,32
- Clock Frequency-Max (MHz)667
- Moisture Sensitivity Level3
- Peak Reflow Temperature (Cel)260
- Operating Temperature-Max (Cel)95
- Operating Temperature-Min (Cel)-40
- Time@Peak Reflow Temperature-Max (s)10
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