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IS29GL256-70DLA3L

Integrated Silicon Solution Inc.

Integrated Silicon Solution Inc. IS29GL256-70DLA3L
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Width (mm)
    9
  • Length (mm)
    9
  • JESD-30 Code
    S-PBGA-B64
  • Memory Width
    1
  • Package Code
    LBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e3
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    BOTTOM
  • Memory Organization
    256MX1
  • Number of Functions
    1
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    70
  • Number of Words Code
    256M
  • Memory Density (bits)
    268435456
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.4
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3
  • Number of Words (words)
    268435456
  • Programming Voltage (V)
    3
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    AEC-Q100

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IS29GL256-70DLA3L