ProductsManufacturers
Events
Send an RFQBOM Tool

IS25WP064-JHLE

Integrated Silicon Solution Inc.

Integrated Silicon Solution Inc. IS25WP064-JHLE
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Technology
    CMOS
  • Width (mm)
    6
  • Length (mm)
    8
  • JESD-30 Code
    R-PBGA-B24
  • Memory Width
    8
  • Package Code
    TBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    QSPI
  • Write Protection
    HARDWARE/SOFTWARE
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    8MX8
  • Number of Functions
    1
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    1
  • Number of Words Code
    8M
  • Memory Density (bits)
    67108864
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    1.95
  • Supply Voltage-Min (V)
    1.65
  • Supply Voltage-Nom (V)
    1.8
  • Data Retention Time-Min
    20
  • Number of Words (words)
    8388608
  • Programming Voltage (V)
    1.8
  • Supply Current-Max (mA)
    130
  • Clock Frequency-Max (MHz)
    133
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

0 suppliers available to buy or to bid for IS25WP064-JHLE

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
IS25WP064-JHLE
Send an RFQ
IS25WP064-JHLE