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IS22ES64G-JCLA2

Integrated Silicon Solution Inc.

Integrated Silicon Solution Inc. IS22ES64G-JCLA2
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NAND TYPE
  • Technology
    CMOS
  • Width (mm)
    11.5
  • Length (mm)
    13
  • JESD-30 Code
    R-PBGA-B153
  • Memory Width
    8
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Memory IC Type
    FLASH CARD
  • Operating Mode
    SYNCHRONOUS
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    EMMC INTERFACE 5.0
  • Memory Organization
    64GX8
  • Number of Functions
    1
  • Number of Terminals
    153
  • Terminal Pitch (mm)
    0.5
  • Number of Words Code
    64G
  • Memory Density (bits)
    549755813888
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    1
  • Seated Height-Max (mm)
    1
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    68719476736
  • Standby Current-Max (A)
    0.000211
  • Supply Current-Max (mA)
    74
  • Package Equivalence Code
    BGA153,14X14,20
  • Clock Frequency-Max (MHz)
    200
  • Moisture Sensitivity Level
    3
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    AEC-Q100

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IS22ES64G-JCLA2
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IS22ES64G-JCLA2