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IS22ES08G-JQLA1

Integrated Silicon Solution Inc.

Integrated Silicon Solution Inc. IS22ES08G-JQLA1
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    MLC NAND TYPE
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Width (mm)
    14
  • Length (mm)
    18
  • Data Polling
    NO
  • JESD-30 Code
    R-PBGA-B100
  • Memory Width
    8
  • Package Code
    LBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Memory IC Type
    FLASH
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    8GX8
  • Number of Functions
    1
  • Number of Terminals
    100
  • Terminal Pitch (mm)
    1
  • Number of Words Code
    8G
  • Memory Density (bits)
    68719476736
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    1
  • Command User Interface
    NO
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    1.4
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    8589934592
  • Programming Voltage (V)
    3.3
  • Package Equivalence Code
    BGA100,12X17,40
  • Clock Frequency-Max (MHz)
    200
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    AEC-Q100
  • Time@Peak Reflow Temperature-Max (s)
    10

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IS22ES08G-JQLA1
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IS22ES08G-JQLA1