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CYWB0125ABX-FDXI

INFINEON TECHNOLOGIES AG

INFINEON TECHNOLOGIES AG CYWB0125ABX-FDXI
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    3.784
  • Length (mm)
    3.788
  • JESD-30 Code
    R-PBGA-B81
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    81
  • Terminal Pitch (mm)
    0.4
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    0.55
  • Supply Voltage-Max (V)
    1.9
  • Supply Voltage-Min (V)
    1.7
  • Supply Voltage-Nom (V)
    1.8
  • Supply Current-Max (mA)
    115
  • Package Equivalence Code
    BGA81,9X9,16
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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CYWB0125ABX-FDXI