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CY8C6117FDI-F02

INFINEON TECHNOLOGIES AG

INFINEON TECHNOLOGIES AG CY8C6117FDI-F02
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • Width (mm)
    3.19
  • Length (mm)
    3.676
  • JESD-30 Code
    R-XBGA-B80
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    80
  • Terminal Pitch (mm)
    0.35
  • Package Body Material
    UNSPECIFIED
  • Seated Height-Max (mm)
    0.467
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    1.7
  • Supply Voltage-Nom (V)
    1.8
  • Package Equivalence Code
    BGA80,11X15,14
  • uPs/uCs/Peripheral ICs Type
    PROGRAMMABLE SoC
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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CY8C6117FDI-F02