Broadcom Inc. BCM53115MKFBG
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width
    17 mm
  • Length
    17 mm
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B400
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Pitch
    0.8 mm
  • Telecom IC Type
    ETHERNET SWITCH
  • Seated Height-Max
    1.71 mm
  • Terminal Position
    BOTTOM
  • Supply Voltage-Nom
    1.2 V
  • Number of Functions
    1
  • Number of Terminals
    400
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA400,20X20,32
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260

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BCM53115MKFBG
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BCM53115MKFBG