GENERAL PURPOSE INDUCTOR

General Purpose Inductor, 510uH, 5%, 1 Element, Iron-Core

General Purpose Inductor, 560uH, 20%, 1 Element, Iron-Core

General Purpose Inductor, 100uH, 10%, 1 Element, Iron-Core

General Purpose Inductor, 620uH, 10%, 1 Element, Iron-Core

General Purpose Inductor, 680uH, 3%, 1 Element, Iron-Core

General Purpose Inductor, 680uH, 20%, 1 Element, Iron-Core

General Purpose Inductor, 750uH, 1%, 1 Element, Iron-Core

General Purpose Inductor, 330uH, 5%, 1 Element, Iron-Core

General Purpose Inductor, 360uH, 20%, 1 Element, Iron-Core

General Purpose Inductor, 360uH, 20%, 1 Element, Ferrite-Core

General Purpose Inductor, 430uH, 10%, 1 Element, Ferrite-Core

General Purpose Inductor, 510uH, 5%, 1 Element, Powdered Iron-Core

General Purpose Inductor, 0.47uH, 1%, 1 Element, Phenolic-Core

General Purpose Inductor, 0.22uH, 5%, Phenolic-Core

General Purpose Inductor, 0.33uH, 1%, Phenolic-Core

General Purpose Inductor, 150uH, 10%, 1 Element

General Purpose Inductor, 0.0047uH, 10%, 1 Element

General Purpose Inductor, 10uH, 10%, 1 Element

Chip inductor for RF applications, type Fastron 1812AS./1812AF. Size 1812, molded in epoxy resin. Solderable up to max. +260 °C/10 s With ferrite carrier material, type 1812AF.

General Purpose Inductor, 180uH, 2%, 1 Element, Ceramic-ferrite-Core, SMD, 1812

RF inductor, 1812AF-221K-01, Fastron This wire wound chip inductor is designed for radio frequency (RF) applications that require optimal Q on high frequency circuits. Its gold flash pad metallization provides better solderability for a higher yield in production. Additionally, their encapsulation not only protects the winding but also allows for surface mount assembly. Applications Mobile telecommunication Automotive subsystems Wireless communication

General Purpose Inductor, 33uH, 2%, 1 Element, Ceramic-ferrite-Core, SMD, 1812

RF inductor, 1812AF-331K-01, Fastron This wire wound chip inductor is designed for radio frequency (RF) applications that require optimal Q on high frequency circuits. Its gold flash pad metallization provides better solderability for a higher yield in production. Additionally, their encapsulation not only protects the winding but also allows for surface mount assembly. Applications Mobile telecommunication Automotive subsystems Wireless communication

General Purpose Inductor, 390uH, 2%, 1 Element, Ceramic-ferrite-Core, SMD, 1812

General Purpose Inductor, 680uH, 2%, 1 Element, Ceramic-ferrite-Core, SMD, 1812