Microsemi Corporation ZL88801LDG1
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    9
  • Length (mm)
    9
  • JESD-30 Code
    S-XQCC-N64
  • Package Code
    HQCCN
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Telecom IC Type
    TELECOM CIRCUIT
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Number of Functions
    1
  • Number of Terminals
    64
  • Package Body Material
    UNSPECIFIED
  • Seated Height-Max (mm)
    1
  • Supply Voltage-Nom (V)
    3.3
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    45
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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