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ZL30244LFF7

Microsemi Corporation

Microsemi Corporation ZL30244LFF7
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    5
  • Length (mm)
    10
  • JESD-30 Code
    R-XBGA-N64
  • Package Code
    HVFLGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, HEATSINK/SLUG, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALSO REQUIRE 3.135V TO 3.465 SUPPLY
  • Number of Functions
    2
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    0.4
  • Package Body Material
    UNSPECIFIED
  • Analog IC - Other Type
    PHASE LOCKED LOOP
  • Seated Height-Max (mm)
    1
  • Supply Voltage-Max (V)
    1.89
  • Supply Voltage-Min (V)
    1.71
  • Supply Voltage-Nom (V)
    1.8
  • Supply Current-Max (mA)
    297
  • Package Equivalence Code
    LGA64,.22X10,16
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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ZL30244LFF7