Texas Instruments Incorporated XTDA2EGBHQCBDQ1
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • JESD-30 Code
    S-PBGA-B760
  • Package Code
    LFBGA
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Terminal Position
    BOTTOM
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA1414,38X38,32
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    AEC-Q100

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