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XR16M770IB25

Exar Corporation

Exar Corporation XR16M770IB25
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    3
  • Length (mm)
    3
  • JESD-30 Code
    S-PBGA-B25
  • Package Code
    VFBGA
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Address Bus Width
    3
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    25
  • Terminal Pitch (mm)
    0.5
  • Number of Serial I/Os
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Communication Standard
    ASYNC, BIT
  • Seated Height-Max (mm)
    0.8
  • Supply Voltage-Max (V)
    3.63
  • Supply Voltage-Min (V)
    1.62
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    8
  • Package Equivalence Code
    BGA25,5X5,20
  • Clock Frequency-Max (MHz)
    64
  • uPs/uCs/Peripheral ICs Type
    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
  • Data Encoding/Decoding Method
    NRZ
  • Data Transfer Rate-Max (MBps)
    2
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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XR16M770IB25
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XR16M770IB25