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XQZU9EG-1FFRC900M

Xilinx,Inc.

Xilinx,Inc. XQZU9EG-1FFRC900M
  • ECCN
    3A001.A.2.C
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    31
  • Length (mm)
    31
  • JESD-30 Code
    S-PBGA-B900
  • Organization
    34260 CLBS
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Number of CLBs
    34260
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • Number of Inputs
    418
  • Number of Outputs
    418
  • Terminal Position
    BOTTOM
  • Number of Terminals
    900
  • Terminal Pitch (mm)
    1
  • Number of Logic Cells
    599550
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.62
  • Supply Voltage-Max (V)
    0.876
  • Supply Voltage-Min (V)
    0.825
  • Supply Voltage-Nom (V)
    0.85
  • Programmable Logic Type
    FPGA SOC
  • Package Equivalence Code
    BGA900,30X30,40
  • Moisture Sensitivity Level
    4
  • Peak Reflow Temperature (Cel)
    245
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-PRF-38535
  • Time@Peak Reflow Temperature-Max (s)
    40

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XQZU9EG-1FFRC900M