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XQZU3EG-L1SFRC784I

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) XQZU3EG-L1SFRC784I
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • Width (mm)
    23
  • Length (mm)
    23
  • JESD-30 Code
    S-PBGA-B784
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • Terminal Position
    BOTTOM
  • Number of Terminals
    784
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.52
  • Supply Voltage-Max (V)
    0.892
  • Supply Voltage-Min (V)
    0.808
  • Supply Voltage-Nom (V)
    0.85
  • Package Equivalence Code
    BGA784,28X28,32
  • Moisture Sensitivity Level
    4
  • uPs/uCs/Peripheral ICs Type
    PROGRAMMABLE SoC
  • Peak Reflow Temperature (Cel)
    220
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    20

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