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XQZU19EG-1FFRB1517M

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) XQZU19EG-1FFRB1517M
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • Width (mm)
    40
  • Length (mm)
    40
  • JESD-30 Code
    S-PBGA-B1517
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1517
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.71
  • Supply Voltage-Max (V)
    0.876
  • Supply Voltage-Min (V)
    0.825
  • Supply Voltage-Nom (V)
    0.85
  • Package Equivalence Code
    BGA1517,39X39,40
  • Moisture Sensitivity Level
    4
  • uPs/uCs/Peripheral ICs Type
    PROGRAMMABLE SoC
  • Peak Reflow Temperature (Cel)
    220
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-PRF-38535
  • Time@Peak Reflow Temperature-Max (s)
    20

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