Xilinx,Inc. XQR18V04CCG44V
  • ECCN
    3A001.A.2.C
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Width
    16.51 mm
  • Length
    16.51 mm
  • Technology
    CMOS
  • Total Dose
    40k Rad(Si) V
  • JESD-30 Code
    S-CQCC-J44
  • Memory Width
    8
  • Organization
    512X8
  • Package Code
    QCCJ
  • JESD-609 Code
    e3
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • Memory Density
    4096 bit
  • Memory IC Type
    CONFIGURATION MEMORY
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Number of Words
    512 words
  • Parallel/Serial
    PARALLEL/SERIAL
  • Terminal Finish
    MATTE TIN
  • Seated Height-Max
    4.826 mm
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Number of Functions
    1
  • Number of Terminals
    44
  • Number of Words Code
    512
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V

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XQR18V04CCG44V