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XQ7Z030-1RF900Q

Xilinx,Inc.

Xilinx,Inc. XQ7Z030-1RF900Q
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • Width (mm)
    31
  • Length (mm)
    31
  • JESD-30 Code
    S-PBGA-B900
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    BOTTOM
  • Number of Terminals
    900
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.44
  • Package Equivalence Code
    BGA900,30X30,40
  • uPs/uCs/Peripheral ICs Type
    PROGRAMMABLE SoC
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40

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XQ7Z030-1RF900Q