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XQ7Z030-1RF676Q

Xilinx,Inc.

XQ7Z030-1RF676Q Datasheet
Xilinx,Inc. XQ7Z030-1RF676Q
  • ECCN
    3A991.D
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    27
  • Length (mm)
    27
  • JESD-30 Code
    S-PBGA-B676
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    BOTTOM
  • Number of Terminals
    676
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.37
  • Package Equivalence Code
    BGA676,26X26,40
  • Moisture Sensitivity Level
    4
  • uPs/uCs/Peripheral ICs Type
    PROGRAMMABLE SoC
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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XQ7Z030-1RF676Q