XQ7Z020-1CL484Q by Advanced Micro Devices, Inc. (AMD) | Sourcengine

Advanced Micro Devices, Inc. (AMD) XQ7Z020-1CL484Q

Lifecycle status
Contact Mfr
Description
FPGA Zynq®-7000 Family 85000 Cells 28nm Technology 484-Pin CSBGA
Category
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs PROGRAMMABLE SoC

HTS Code
8542.31.00.01
SB Code
8542.31.00.70

Technology
CMOS
Width (mm)
19
Length (mm)
19
JESD-30 Code
S-PBGA-B484
Package Code
LFBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
AUTOMOTIVE
Terminal Position
BOTTOM
Number of Terminals
484
Terminal Pitch (mm)
0.8
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.6
Package Equivalence Code
BGA484,22X22,32
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
PROGRAMMABLE SoC
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30