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XQ5VFX70T-2EF665I

Xilinx,Inc.

Xilinx,Inc. XQ5VFX70T-2EF665I
  • ECCN
    3A991.D
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width
    27 mm
  • Length
    27 mm
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B665
  • Package Code
    BGA
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Number of CLBs
    6080
  • Terminal Pitch
    1 mm
  • Terminal Finish
    TIN LEAD
  • Number of Inputs
    360
  • Number of Outputs
    360
  • Seated Height-Max
    2.9 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Supply Voltage-Max
    1.05 V
  • Supply Voltage-Min
    0.95 V
  • Supply Voltage-Nom
    1 V
  • Clock Frequency-Max
    1265 MHz
  • Number of Terminals
    665
  • Qualification Status
    Not Qualified
  • Number of Logic Cells
    71680
  • Package Body Material
    PLASTIC/EPOXY
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    BGA665,26X26,40
  • Operating Temperature-Max
    100 Cel
  • Operating Temperature-Min
    -40 Cel
  • Combinatorial Delay of a CLB-Max
    0.77 ns

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XQ5VFX70T-2EF665I