XQ2VP70-6EF1704N

Xilinx,Inc.

Xilinx,Inc. XQ2VP70-6EF1704N
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.60
  • SB Code
    8542.31.00.60
  • Technology
    CMOS
  • Width (mm)
    42.5
  • Length (mm)
    42.5
  • JESD-30 Code
    S-PBGA-B1704
  • Organization
    8272 CLBS
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Number of CLBs
    8272
  • Terminal Finish
    TIN LEAD
  • Temperature Grade
    MILITARY
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1704
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.45
  • Supply Voltage-Max (V)
    1.575
  • Supply Voltage-Min (V)
    1.425
  • Supply Voltage-Nom (V)
    1.5
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    BGA1704,42X42,40
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Combinatorial Delay of a CLB-Max (ns)
    0.32

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