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XPC860MHCZP33C1

Motorola,Inc.

Motorola,Inc. XPC860MHCZP33C1
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    25
  • Length (mm)
    25
  • JESD-30 Code
    S-PBGA-B357
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    357
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.05
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Package Equivalence Code
    BGA357,19X19,50
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Operating Temperature-Min (Cel)
    -40

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XPC860MHCZP33C1