Freescale Semiconductor, Inc. XPC850SRVR66BU
  • ECCN
    5A991
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Speed
    66 rpm
  • Width
    23 mm
  • Format
    FIXED POINT
  • Length
    23 mm
  • Bit Size
    32
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B256
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Terminal Pitch
    1.27 mm
  • Integrated Cache
    YES
  • Address Bus Width
    26
  • Seated Height-Max
    2.35 mm
  • Terminal Position
    BOTTOM
  • Supply Voltage-Max
    3.465 V
  • Supply Voltage-Min
    3.135 V
  • Supply Voltage-Nom
    3.3 V
  • Clock Frequency-Max
    66 MHz
  • Number of Terminals
    256
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • External Data Bus Width
    32
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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XPC850SRVR66BU