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XDM505XXBABF

Texas Instruments Incorporated

XDM505XXBABF Datasheet
Texas Instruments Incorporated XDM505XXBABF
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B367
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    BOTTOM
  • Number of Terminals
    367
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    1.2
  • Supply Voltage-Min (V)
    1.11
  • Supply Voltage-Nom (V)
    1.15
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    AEC-Q100

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XDM505XXBABF